| ??? 04/16/05 09:46 Read: times |
#91721 - Multi-Layer Boards Responding to: ???'s previous message |
Now the real Problem... Some of the newer chips such as LPC2124 [ ARM ] as shown in figure above have the anlog function related pins scattered on two or more sides with some digital pins in between them and not on the same side. How to lay separate ground planes AGND and DGND in such situations? This is a situation where you need multi-layer boards if you really need solid ground planes. There is a limit to a double sided board, so if you can't place solid ground planes in such a situation and multi-layer is out of reach then try thicker ground traces, copper pours etc. |
| Topic | Author | Date |
| WEOT: Ground layout problems. | 01/01/70 00:00 | |
| Multi-Layer Boards | 01/01/70 00:00 | |
| For Your Chio Example | 01/01/70 00:00 | |
| Thats great. | 01/01/70 00:00 | |
| Well....Here's One Idea | 01/01/70 00:00 | |
Thanks Michael, | 01/01/70 00:00 |