Hi all,

I am trying to use the reflow technique to assemble my board. I have a SiLabs chip on my board - C8051F123

In the datasheet of C8051F123 it says that the maximum storage temperature of the chip is 150 C.

I have been looking around on the web for reflow techniques and in all of them the reflow profile shows the max temperature being achieved is well above 200 C.

Would it still be Ok to use the reflow technique ? Or is there some other way i.e. other than hand soldering.

Thanks
Ashish