| ??? 06/25/03 15:16 Read: times |
#49314 - RE: ADC on chip in DIL pack Responding to: ???'s previous message |
Hallo Jignesh,
don't insist on DIL package. It's really oldfashioned. Ground bounce can be 5 times higher compared to modern package style! Can't you at least use PLCC package? That's no problem at all, when you use a socket. Some manufacturer stop fabricating certain mcu in DIL package. They know why... Bye, Kai |
| Topic | Author | Date |
| ADC on chip in DIL pack | 01/01/70 00:00 | |
| RE: ADC on chip in DIL pack | 01/01/70 00:00 | |
| RE: ADC on chip in DIL pack | 01/01/70 00:00 | |
| chip packages | 01/01/70 00:00 | |
| Hand solder MLF | 01/01/70 00:00 | |
RE: chip packages | 01/01/70 00:00 | |
| RE: ADC on chip in DIL pack | 01/01/70 00:00 |