| ??? 06/26/03 03:10 Read: times |
#49382 - chip packages Responding to: ???'s previous message |
Hi,
Maybe the reason for not offering the DIP package is not the higher ground bounce but the packaging cost. The current trend is to go with smaller and smaller packages. TSSOP and LQFP are standard packages now, HVQFN (MLF) will most likely be the next. An example of the HVQFN package: standard.http://www.semiconductors.philips.com/acrobat/p...T815-1.pdf DIP, PLCC and SO are still offered though. Just wondering what your comments would be on this trend, and what you are using now. Regards, Bauke |
| Topic | Author | Date |
| ADC on chip in DIL pack | 01/01/70 00:00 | |
| RE: ADC on chip in DIL pack | 01/01/70 00:00 | |
| RE: ADC on chip in DIL pack | 01/01/70 00:00 | |
| chip packages | 01/01/70 00:00 | |
| Hand solder MLF | 01/01/70 00:00 | |
RE: chip packages | 01/01/70 00:00 | |
| RE: ADC on chip in DIL pack | 01/01/70 00:00 |