Erik Malund wrote:
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BEWARE of Winbond, they do not make bondouts, so you can not get ICE.


Hi Erik, whats the problem on this ?

Only on ROM or OTP devices ICE was needed.

On ISP Flash devices developing was easier without ICE, since then I have no space or connector problems or influence of ground loops and many other problems.

Addditional its cheaper and I be more flexible, since I can fit the right device to my application, not my application to the ICE.


Peter