I that'd be virtually pointless.
The aim of burn-in is to accelerate the infant mortalities (see Erik's "bathtub curve") so that they die during the burn-in, rather than after they've reached a customer. The acceleration is achieved by running at elevated temperature - hence burn-in. Thus "room-temperature burn-in" is an oxymoron.


That's called Functional Test - nothing to do with Burn-In.


As Erik said, they're not faults, they're a Design Flaws


No.
You are confusing Burn-In with Running-In.
As already described, the purpose of Burn-In is to accelerate the failure of flawed parts;
The purpose of Running-In is to allow parts to bed-in, by giving them a period of gentle operation - quite the opposite of Burn-In! This is applied to mechanical moving parts - I can't think of any application for electronic components?


There is a vast body of literature on all aspects of Reliability, Failure Modes, Quality Control, Quality Assurance, etc, etc, etc
I suggest you seek out the appropriate professional body in your territory.