Raghunathan,
As I understand, the process of replication works to expose the inner layer at the full plane of the copper in that layer. If vias have pads on those inner layers they will show on the revealed copper layer as a circle with a hole in the middle. A via with no pad will only show its hole plating.

I suggest also that the process of revealing the inner layer is not a procedure involving grinding. Instead think of a planar sanding process that carefully removes the whole outer layers in a flat manner. I have actually had to do this one time with a powered orbital hand sander in order to perform failure analysis on a batch of circuit boards. These boards had multiple ground planes with signal layers sandwiched inside and it was necessary to sand away the outer layers to investigate the internal manufacturing mistake and what was causing it. I found the process required fine sandpaper because it was very easy to sand too much in any one area and go right through the layer of interest!!

Michael Karas