| ??? 05/14/03 14:21 Read: times |
#45425 - RE: Winbond source Responding to: ???'s previous message |
Mikkel:
What appears to be unmanageable packaging problem by you has not been a issue for me and many others. The programming of parts is handled via a JTAG download. And it does not take a couple of years to implement it (or were you joking?). And as for price....Some parts are more expensive yes but feature for feature and MIPS per MIPS they are comparable to the competition in quantity purchases. The cost of single chips for development is nearly irrelevant compared to the labor costs of building an application program !! And to top all that off the Cygnal onboard debug hardware support, in every chip including your in field target product, goes a long way toward reducing labor costs over the total life cycle of the product. Michael Karas PS. I gave Cygnal to you as a suggestion.........not to feel as if I have to defend it. MJK |
| Topic | Author | Date |
| Winbond source | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 | |
| RE: FLip tools are available for linux | 01/01/70 00:00 | |
| RE: FLip tools are available for linux | 01/01/70 00:00 | |
| RE: FLip tools are available for linux | 01/01/70 00:00 | |
| RE: FLip tools are available for linux | 01/01/70 00:00 | |
| RE: FLip tools are available for linux | 01/01/70 00:00 | |
| RE: FLip tools are available for linux | 01/01/70 00:00 | |
RE: FLip tools are available for linux | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 | |
| RE: Winbond source | 01/01/70 00:00 |



