| ??? 09/08/04 03:43 Read: times |
#77066 - RE: DS1232 & ESD Responding to: ???'s previous message |
When the chip is soldered on the circuit board, there will be a "discharge path" and thsu the amount of esd required to blow the chip will be much higher.
Mhm, are you sure? If chip isn't soldered to anything, applied charged object will cause a violent separation of charges on die. Result: Destruction! If chip is soldered to anything, applied charged object will cause a violent current flowing through the die. Result: Destruction! I don't think, that there's much difference. But maybe I'm wrong... Kai |
| Topic | Author | Date |
| DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| Human Body Model | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| RE: DS1232 & ESD | 01/01/70 00:00 | |
| ESD in general | 01/01/70 00:00 | |
| RE: ESD in general | 01/01/70 00:00 | |
| RE: ESD in general | 01/01/70 00:00 | |
| RE: ESD in general | 01/01/70 00:00 | |
RE: ESD in general | 01/01/70 00:00 |