"With only some exceptions, solid state components pretty well are."

I'm sorry Steve, pretty well are what? I couldn't figure out what previous remark this applied to.

We haven't tried anything yet. We just recently received some components that we know will not be subject to potting and therefore will only be immersed in the dielectric fluid without any protection from the pressure. Our plan is to conduct pressure testing on these parts in the days ahead.

I would characterize the circuit as a mix of analog and digital. There is an analog signal conditioner for the pressure sensor and some analog circuitry for the motor interface. Pressure sensor output is low level, then amplified and conditioned but resolution doesn't need to be more than 8-10 bits.

Package size is as I said, small. The goal (if achievable) is to house the electronics in a cylindrical housing with approx. 2" dia. bore, maybe 2" deep. The circuit would probably be spread across multiple boards sandwiched together. But the whole potting initiative may dramatically affect that and require a larger envelope. Per your comments about stresses and strains I suspect bigger = better.

Thanks again.
SC