Hi Pontus,
Thank you very much for valuable suggestions...

Try to avoid 90 degree bends on your tracks. Using two 45 deg bends (or a radius) reduces EMI.

I have posted the new layouts these. In these new layouts I have taken care of avoiding 90 degree bends I am using two 45 deg bends in place of a 90 deg bend.

There's very little gain (if any) in having the track run in 30 mils and then reducing it to 13 mil. Keep you tracks even. This will make it esier when you need to change the layout. Of course power tracks need to be as fat as possible.

I have replace 30mil traces in the layout with 13 mil traces.

When laying your board out, try to use only 0, 90 and 45 deg angled tracks as this will make it much easier to change the layout.

In the new layout I have taken care of this as well I am using only 0 and 45 bends.

Place the crystal caps beside each crystal pin to reduce the track lengths. Your design will probably work but it is good practise to reduce crystal tracks as much as possible.

I have changed the layout to reduce the crystal and 33pF capacitor trace lengths, Thanks to Kai for posting the sample layout.

Thanks & Regards,
Prahlad Purohit