??? 10/14/05 13:13 Read: times |
#102414 - But... Responding to: ???'s previous message |
Erik said:
I have no doubt that eventually the lead free process will wotk just as well as what we use today, but I do agree that it is tough to work during the transition. Today, they HAVE problems. Lead time and lead temperature must be increased to get reliable solder points. But any increase in heat stress will heavily degrade reliability of SMD-parts. This IS a time bomb, unless manufacturers of SMD components increase heat resistance of their parts. But this will need many years or development and testing. Recall how many years it took to get SMD-soldering become reliable... Kai |