Jan:

I reread the OPs posts, and it is not clear to me if he is trying to verify the published limits, or is simply trying to see how far he can push the chip. I believe his goal is the verification of the limits.

I also read a NXP data sheet, and they do prohibit the operation of the part beyond 85C. So I agree that the OP should not operate beyond that point.

Just for reference, the Commercial / Industrial / Military parts are almost always the same die and the same process. If there is a difference, it is that the Military parts come from the center of the process specifications. This is because transistor characteristics shift with temperature, and if you start on the edge of the specification, then you will be out of spec at one temperature extreme or the other.

My point to Erik was that there should be no physical damage to the part as a result of 100C operation.