Hi Rob,

"Do you intend to use the hot airgun method as advocated by some on the Si-labs forum.."

Yes, that's how I want to do it. This is a technique I have been using with great success for every type of SMD except fine-pitch (TQFP, SSOP) for some time now. Getting the solder paste dosage right will be the biggest challenge, I think.

"The minimum DRC I work to for track spacing and width is 10thou [...] Does the pad/track spacings on the CP2101 fit within my rules.."

If you follow the "Typical MLP-28 Landing Diagram" in the datasheet, no. The pad spacing they use is 0.2mm = 8 mil. However, if your PCB manufacturer is worth his salts, they should have no problem with 8-8 rules; mine don't charge me extra for it.

"How long before they just ship the wafer?.."

I do not even want to think about that ... :o(


Best regards,
Rob.