My techniques for making PCBs and soldering SMD circuits are similar to the described, however, I have a few "specialties".

To make a double sided print, I take 2 masks made by Laser on a transparent folie (by the way - always make a mirrored image for top layer, so that Laser prints get closest to copper). I put some glue (not the quick one!) only along one edge, then align them well and let the glue work. Now, the most delicate - after lighting one side how to turn it all upside down ? My solution is, before lighting, to find a little of not used area on any of layers, apply glue there (carefully and not too much !), put the plate in between, press it and let it dry ! Before etching, just remove mechanically the trace of glue on the PCB.

For good soldering, the PCB must be perfectly clean. When the PCB is dry, I use a sheet of paper (not sandpaper, just common paper for writing) and wipe it thoroughly.

Soldering is not so big problem, however a great care and good soldering tools are important. In case of fine-pitch components, it's possible to solder the pins willingly making shorts among them, and then to apply suck-thread (or is it called solder-wick ?). It should remove the unwanted connections, but a very good visual control is necessary. One advice: suck-thread works much better if it first has got a very small amount of thin directly from the thin-wire. In worst cases, the bridges are almost invisible, then use an ohmmeter to locate them.

One more advice: in print design avoid the through-connections (vias) under the ICs, when you connect them after, you get a problem to place the IC.