??? 07/09/04 05:54 Read: times |
#73846 - RE: Heat damaging components Responding to: ???'s previous message |
which peaks the board at 230 C for 10 seconds, then brings it down again That's today... the industry is rapidly converting to "Pb-free" parts which need to be compatible with a process peaking at 260 C. So the parts that are impossible to overheat today will become really impossible to overheat next year. (Until you convert your lab to Pb-free.) The reason is that Pb-free solders melt approximately 30 C hotter than the SnPb solders. Many parts already don't contain any Pb, but "Pb-free" parts also need to be compatible with the 260 C processes. Converting your home lab to "Pb-free" will mostly involve obtaining solder tips approx. 30 C hotter and replacing your Sn-Pb solder with Sn-Ag-Cu solder. |