| ??? 07/09/04 00:41 Read: times |
#73845 - RE: Heat damaging components Responding to: ???'s previous message |
Paul Connor wrote:
------------------------------- Whenever I solder a board I am always nervous about damaging components. With an iron I tend to go as quickly as possible to minimise the risk but I don't really have any idea of how much devices can take or at what point they begin to become damaged. ...In 35 years of messing around with soldering, I have NEVER ruined a part by overheating it (with an iron at least :-( ) GERMANIUM devices were a lot more sensitive to heat than silicon, and a lot of the fear still carries over in the text books. Joseph has all the low down on the reality of heating profiles. We use a 4000 USD reflow oven for our boards, which peaks the board at 230 C for 10 seconds, then brings it down again, in a 5 minute cycle. Steve |
