??? 07/09/04 18:26 Read: times |
#73900 - RE: Moisture damaging components Responding to: ???'s previous message |
Kai Klass said:
Todays highest integrated digital chips suffer from another failing mechanism: Moisture having penetrated package, because of wrong storing of chips in unsealed enclosures. If such a chip is soldered, moisture will heat up and steam is produced, which causes overpressure and destroys the ultrasonic bonded wire contacts internally of chip. Thanx Kai for giving me the opportunity to ask about that issue: Moisture. Perfect timing and the perfect thread to ask for it! So, here's the question: OK, you suppose to store the chips in anti-static sealed enclosures. And what happens if you open these enclosures in room environment, get the chips out of them and then again put your chips inside the enclosures, close them and store them (for days or months before using them)? As you know there are warnings in these enclosures that say that if you open the enclosures you have to put your chips in an oven for a given time and temperature before soldering them. But what about a room environment, where it is supposed to have very low moisture levels (no matter if it is winter or summer, cause in the first case you have the radiator heating the room and in the second... it's summer ;) ? I have asked and others say "no problem", others say "you 've got a problem, you have to use the oven as mentioned by the manufacturer". So? George |